Nanoindentor with attached SPM, [Nanotom Technologies Pvt. Ltd, INDIA]
Located at: CRF Annexe - F05
Nano Indentation System is based on Load – Displacement type with automatic measurement capability for mechanical properties at Nano Scale and microscale for thin films, coatings & bulk materials (soft and hard materials), polymer film systems, metals, multi-phase alloys, bio samples, composites & ceramics etc. Nano Indentation system house the Nano Indentation & Optical Microscope modules along with Atomic Force Microscope. Nano Indentation system is provided with suitable antivibration table to minimize environmental vibrations. System should has dedicated controlled and high-end computer with the latest configuration and licensed software. The system consists of essential parts needed to do nanoindentation and other measurements such as:
• Continuous Dynamic Mechanical Property Measurements: Continuous Measurement of hardness, storage modulus, loss modulus, complex modulus, tan-delta, etc. as the function of contact depth, frequency, and time.
• Atomic Force Microscope: 3D Imaging of Nano Indentation using dedicated Atomic Force Microscope and measure surface roughness, crack lengths, indentation depths, etc.
• High Load Indentation, Scratch and Wear
• Determine all parameters specified in ISO 14577 or ASTM E2546
Applications: Mechanical properties at Nano Scale and micro scale for thin films, coatings & bulk materials (soft and hard materials), polymer film systems, metals, multi-phase alloys, bio samples, composites& ceramics etc.
Specifications for Nanoindentor with attached SPM
1) Sample Dimensions: Sample diameter 15 - 50 mm
2) Normal Loading:
• Load Actuator : Specify the type
• Depth Sensor : Specify the type
• Maximum Force : 100mN or higher
• Minimum Contact/scanning Force : ≤ 100nN
• Load Rate : 15mN/s or better
• Load Noise Floor : 0.1 µN or better
• Load Resolution : <20 nN
• Maximum indentation Depth : 50 µm or higher
• Depth Noise Floor : <0.5 nm
• Depth Resolution : < 0.003 nm
• Indenter Travel Range : 100 µm or higher
• Frame Stiffness : 108 N/m or better
• Thermal Drift at room temperature : 0.005 nm/s or better
• Indenter : Calibrated Berkovich, Vickers, Cube Corner, Spherical, Conical indenter. Also, five Spare Berkovich indenter to be provided.
3) Continuous Dynamic Mechanical Property Measurements:
• Dynamic Mechanical Analysis testing in the range 1 – 200 Hz
• Continuous multicycle
• Continuous Measurement of hardness, storage modulus, loss modulus, complex modulus, tan-delta, etc. as a function of contact depth, frequency, and time.
4) Stage Specifications:
• XY Travel :at least 50mm x 50mm
• XY Stage Resolution : 35 nm or better
• Z Travel : 30 mm or higher
• Z Stage Resolution : 10 nm or better
• Maximum XY Translation Speed 10mm/s and maximum Z Translation Speed 10mm/s
5) Optical Microscope:
• Optical Magnification : x50 to x1000 or higher
• Optical Resolution : <1µm
• Infinity corrected objectives: 5X, 20X, 50X and 100X.
• High Quality video camera (resolution 1280 x 1024 Pixels) with 60 fps or better. Video capturing should be available.
6) Atomic Force Microscope:
3D Imaging of Nano Indentation using dedicated Atomic Force Microscope (AFM). A dedicated AFM cantilever probe/Tip should be used for scanning & imaging purpose. The imaging should be able to measure surface roughness, crack lengths, indentation depths, etc. AFM in Contact Mode with integrated Video Microscope Dual View with below specs should be offered:
| Max scan range XY |
100 x 100 μm |
| Max Z range |
20 μm |
| Drive resolution Z |
0.4 nm or better |
| Drive resolution XY |
2 nm or better |
| X/Y linearity mean error |
< 0.6 % |
| Z noise level (RMS) in basic mode |
0.350 nm (max 0.500 nm) |
| Z noise level (RMS) in dynamic mode |
0.09 nm (max 0.15 nm) |
| Alignment of cantilever |
Automatic adjustment |
| Dynamic frequency range |
15 - 300 kHz with resolution < 0.1 Hz |
| Phase contrast |
± 90 ° with resolution < 0.05 ° |
| Phase reference |
0 - 360 ° |
| Tip Positioning Accuracy |
+/-20nm |
6) Atomic Force Microscope:
• Normal Load: 10 mN to 20 N or higher
• Normal Load Resolution : < 6 µN
• Normal Load Noise Floor : < 250 µN
• Loading Rate : ≤ 300 mN/min
• Frame Stiffness : ≥ 10⁸ N/m or higher
• Maximum indentation Depth : 100 µm
• Indentation Depth Noise Floor : < 1.5 nm
• Normal Depth Bit Resolution : <0.03 nm
• Maximum Indenter Travel Range : 200 µm or more
• Lateral force (X and Y axis) : 10 mN to 20N or higher
• Lateral force bit resolution : 10 μN
• Normal Force Range for Scratch Mode : 10 mN to 20 N or higher
• Load Resolution: 10 µN
• Max scratch length: 60mm or more preferred (with Imaging of full scratch)
• Scratch speed: 0.4 mm/min to 600 mm/min
• Video imaging to cover the entire scratch lengths obtained during scratch testing synchronized with measurement data. Post-scan and pre-scan modes for topography scanning should be available.
• Acoustic emission measurement during scratch testing is required to assess scratch testing events
Testing charges (hourly basis).
| Internal/external (academia) |
Rs. 1000/- per hour |
| R&D labs/Industry |
Rs. 2000/- per hour |
*Sample preparation charges, GST(18%) extra. Above charges are for providing raw data.
For further Query Contact:
Dr. RAMESH M.R (Nanoindentor Faculty in-charge), Email: rameshmr@nitk.edu.in, Mob: +91-9480540801, +91 824-2473677
